BALL GRID ARRAY SOCKETS 1.27 mm GRID / INTERCONNECT PIN / SOLDER TAIL / SURFACE MOUNT
关键词:连接器
产品详情
Ball grid array interconnect pin, through hole solder tail and surface mount.
TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSULATOR Glass-epoxy laminate FR4
FLAMMABILITY UL 94V-O
CONTACT Brass CuZn36Pb3 (C36000)
MECHANICAL LIFE Min. 100 cycles
RATED CURRENT 1 A
CONTACT RESISTANCE Max. 10 mΩ
DIELECTRIC STRENGTH Min. 500 VRMS
ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PLATING CODE TERMINATION CONNECTING PIN
10 0.25 μm gold 0.25 μm gold
Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body size
and layout numbers as indicated on page 168.
For example a 20x20 pin configuration with 256 contacts as shown
on page 168 becomes 550-10-256M20-001152.
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