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MICRO PIN GRID ARRAY SOCKETS 1.27 mm GRID / SOLDER TAIL / SURFACE MOUNT / INTERCONNECT PIN
Micro pin grid array sockets (μPGA) with contacts placed on 1.27 mm grid, solder tail, surface mount and interconnect pin.
TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSULATOR Glass-epoxy laminate FR4
FLAMMABILITY UL 94V-O
SLEEVE / PIN Brass CuZn36Pb3 (C36000)
CONTACT CLIP (6 FINGER) Beryllium copper (C17200)
ACCEPTED PIN Ø 0.30 to 0.35 mm
FORCES 0.2 N typ. insertion 0.15 N typ. withdrawal
(polished steel gauge Ø 0.3 mm)
MECHANICAL LIFE Min. 100 cycles
RATED CURRENT 1 A
CONTACT RESISTANCE Max. 10 mΩ
DIELECTRIC STRENGTH Min. 500 VRMS
ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PLATING CODE SLEEVE CLIP
77 (Serie 518) Flash gold Flash gold
PP PLATING CODE TERMINATION CONNECTING PIN
10 (Serie 558) 0.25 μm gold 0.25 μm gold
Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body size
and layout numbers as indicated on page 168.
For example a 26x26 pin configuration with window and 478 contacts
as shown on page 168 becomes 518-77-478M26-131105.
Options: please consult for availability
- μPGA interconnect headers for SMD mount.
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